Thermal Interface Materials

Flexible sheet of thermal interface material

Benefits

Long-term Performance in Challenging Environments

VB200 is a sheet-type thermal interface material (TIM) based on a unique elastomer designed to solve the thermal management issues associated with miniaturization and high integration of electronic devices.

Illustration of Thermal conductivity for TIMs. Heat generated from the IC chip is transferred through TIM1 to the lid, then from the lid to the heat sink via TIM2. Labels show VB200 TIM can be applied in both TIM1 and TIM2 applications.

High Thermal Conductivity, Low Thermal Resistance

VB200 has exceptional thermal conductivity of 38 W/m·K in the thickness (Z-) direction which ensures efficient heat transfer in high-performance electronics. VB200 can be used for both TIM 1 and TIM 2 applications, filling gaps between heat sources and heat sinks and transferring heat efficiently to cool down IC chips. The high thermal conductivity is due to the low thermal resistance combined with the thin film format.

Line graph showing thermal performance with repeated heat cycles. X-axis: number of cycles (0–800). Y-axis: thermal resistance (K/W).

Durability After Repeated Cycles

VB200 maintains its superior thermal performance even after extensive cycling and high-temperature exposure. After 600+ cycles between -55 °C and 150 °C at 1 minute intervals the thermal resistance is virtually unchanged.